4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Hiroaki Tetsuka

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Curable organopolysiloxane composition and semiconductor device

Coating processes – With post-treatment of coating or coating material – Heating or drying
Reexamination Certificate

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Heat-dissipating member, manufacturing method and...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Thermoconducting silicone composition, its curing product...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2839979

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