Curable organopolysiloxane composition and semiconductor device

Details Curable organopolysiloxane composition and semiconductor device Curable organopolysiloxane composition and semiconductor device

2006-11-28

2006-11-28

Zimmer, Marc S. (Department: 1712)

Coating processes

With post-treatment of coating or coating material

Heating or drying

C524S438000, C524S439000, C524S588000, C528S015000, C528S031000, C528S032000, C428S447000

Reexamination Certificate

active

07141273

ABSTRACT:
Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 μm, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.

REFERENCES:
patent: 6624224 (2003-09-01), Misra
patent: 2005/0040507 (2005-02-01), Matayabas et al.
patent: 2005/0228097 (2005-10-01), Zhong
patent: 0 696 630 (1996-02-01), None
patent: 7-207160 (1995-08-01), None
patent: WO 2004/008497 (2003-07-01), None

Affiliated with

Also associated with

Rating

Curable organopolysiloxane composition and semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Curable organopolysiloxane composition and semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable organopolysiloxane composition and semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3685992