Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-09-06
2005-09-06
Gulakowski, Randy (Department: 1712)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S709000, C428S447000, C428S450000
Reexamination Certificate
active
06940722
ABSTRACT:
A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 μm and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 μm. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, together with a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, such that (1)/[(1)+(2)]=0.2-1.0.
REFERENCES:
patent: 6620515 (2003-09-01), Feng et al.
patent: 6761928 (2004-07-01), Hill et al.
patent: 6791839 (2004-09-01), Bhagwagar
Aoki Yoshitaka
Mita Kunihiko
Tetsuka Hiroaki
Yamada Kunihiro
Yoneyama Tsutomu
Gulakowski Randy
Keehan Christopher
Millen White Zelano & Branigan P.C.
Shin-Etsu Chemical Co. , Ltd.
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