Thermoconducting silicone composition, its curing product...

Details Thermoconducting silicone composition, its curing product... Thermoconducting silicone composition, its curing product...

2005-04-26

2005-04-26

Feely, Michael J. (Department: 1712)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C524S860000, C524S861000, C524S862000, C524S863000, C524S866000

Reexamination Certificate

active

06884660

ABSTRACT:
The present invention relates to a thermoconducting silicone composition having a viscosity at 25° C. before curing of 10-1,000 Pa·s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.

REFERENCES:
patent: 5021494 (1991-06-01), Toya
patent: 6069201 (2000-05-01), Kashiwagi et al.
patent: 20030234074 (2003-12-01), Bhagwagar
patent: 696630 (1997-05-01), None
patent: 1254924 (2002-11-01), None
patent: WO 03067658 (2003-08-01), None
JP '8053664, Patent Abstracts of Japan, filed Feb. 27, 1996, corresponding to EP 696630, May 14, 1997.
JP 6196884A, Patent Abstracts of Japan.
Patent Abstracts of Japan, Jan. 30, 1998, vol. 1998, No. 01, & Hitachi Powered Metals Co Ltd, JP 09227979 A, “Low thermal expansion sintered alloy,” Sep. 2, 1997, abstract.

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