4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Hayami Matsunaga

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active

Integrated circuit device on metal board with CPU power...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Method for fabricating a multilayer ceramic substrate

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of manufacturing a packaging substrate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Method of manufacturing an electronic component

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Method of manufacturing ceramic substrate

Printing – Intaglio – Processes
Reexamination Certificate

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Profile ID: LFUS-PAI-P-692866

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