Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
1996-02-16
2001-10-16
Chaudhuri, Olik (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S724000, C257S725000, C361S719000, C361S783000, C361S803000
Reexamination Certificate
active
06303989
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to integrated circuit devices for use in such civilian equipments as an electronic equipment, electrical equipment, communication equipment and measuring and controlling equipment.
BACKGROUND OF THE INVENTION
In the following, a description will be given with respect to a conventional integrated circuit device.
A conventional integrated circuit device has its component parts consisting of a power supply, CPU chip, cache controller, cache memory, data buffer LSI and connector mounted on a single, one or two-sided multi-layer circuit wiring board (motherboard), while electrically connecting respectively to desired component parts, and it includes heat radiating plates for individually radiating heat of the component parts and is provided with a cooling fan facing the heat radiating plates.
In the construction of the above-described conventional integrated circuit device, since the component parts are mounted on a single multi-layer circuit wiring board and the heat radiating plates are provided for individually effecting heat radiation, there has been a problem that the area of the board is increased and a sufficient heat radiation cannot be effected without using a cooling fan.
To solve the above conventional problem, it is an object of the present invention to provide an integrated circuit device which is improved in the degree of integration and is excellent in heat radiating characteristic.
SUMMARY OF THE INVENTION
To solve this problem, an integrated circuit device of the present invention has a construction comprising: a metal board having a power supply; a multi-layer circuit wiring board having a plurality of pin terminals fitted therein and electrically connected to said power supply on the metal board; a CPU chip having TAB wiring electrically connected to said multi-layer circuit wiring board between said metal board and said multi-layer circuit wiring board; a cache memory section and data buffer LSI section electrically connected to said multi-layer circuit wiring board on a surface opposite to the CPU chip provided on said multi-layer circuit wiring board; and a connector electrically connected to said multi-layer circuit wiring board.
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Iwata Masao
Katsuragawa Ryoichi
Matsunaga Hayami
Suehiro Yoshikazu
Yasuho Takeo
Chaudhuri Olik
Ha Nathan
Matsushita Electric - Industrial Co., Ltd.
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