Method of manufacturing an electronic component

Details Method of manufacturing an electronic component Method of manufacturing an electronic component

1997-06-06

2000-04-18

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438611, 438616, 438622, 438623, 438662, 438670, 438977, H01L 21483, H01L 2156, H01L 2158, H01L 2160

Patent

active

060514485

ABSTRACT:
In a method of manufacturing an electronic component for forming a conductor pattern on an insulating substrate by transfer method employing intaglio printing technique, this manufacturing method comprises a step of fabricating an intaglio 20 made of flexible resin forming an insulating layer 23 on a groove 21, a step of filling the groove 21 with Ag paste 24 and drying, a step of overlaying the intaglio 20 on an insulating substrate 2 having a water-soluble resin 28 formed on the surface by pressing a pressing portion 26, freezing, peeling off the intaglio 20 and insulating substrate 2, and transferring the pattern of the Ag paste 24, and a step of firing it and forming a conductor pattern.

REFERENCES:
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 3719981 (1973-03-01), Steitz
patent: 4857482 (1989-08-01), Saito et al.
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5546375 (1996-08-01), Shimada et al.
patent: 5643831 (1997-07-01), Ochiai et al.

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