4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Hans-Hermann Oppermann

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Chip module with conductor paths on the chip bonding side of a c

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Chip-contacting method requiring no contact bumps, and electroni

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Chips arranged in plurality of planes and electrically...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Contact-bumpless chip contacting method and an electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Process for the formation of a spatial chip arrangement and...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-809268

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