4. Semiconductor device manufacturing: process
  5. Formation of electrically isolated lateral semiconductive...
  6. Grooved and refilled with deposited dielectric material

Han-Liang Tseng

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Chip holder with wafer level redistribution layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Ion implant method for forming trench isolation for integrated c

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Patent

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Method for fabricating a semiconductor package including...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method for improved dielectric layer metrology calibration

Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate

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Method for shielding polysilicon resistors from hydrogen intrusi

Electrical resistors – With base extending along resistance element – Resistance element and/or terminals printed or marked on base
Patent

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Profile ID: LFUS-PAI-P-734212

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