4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Hajime Kuwajima

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Acoustic wave device face-down mounted on a substrate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Electronic component

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Electronic component

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Electronic component comprising a coil conductor and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Electronic component to protect an interface between a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Profile ID: LFUS-PAI-P-2096604

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