4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing

H. Kelly Flesher

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Flexible electronic card and method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Flexible electronic card and method

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Patent

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Stress-free silicon wafer and a die or chip made therefrom

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Patent

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Stress-free silicon wafer and a die or chip made therefrom...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Stress-free silicon wafer and a die or chip made therefrom...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-120271

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