Semiconductor device manufacturing: process – Semiconductor substrate dicing
Patent
1996-09-17
1998-03-31
Niebling, John
Semiconductor device manufacturing: process
Semiconductor substrate dicing
438464, 438977, 257679, H01L 21301, H01L 2146, H01L 2178
Patent
active
057338140
ABSTRACT:
A flexible electronic card for use with an electronic card reader comprising a flexible substrate formed of plastic. The card has dimensions such that it can fit into a conventional billfold. A flexible semiconductor device is carried by the flexible substrate and is accessible electronically by the electronic card reader. The card and the semiconductor device carried thereby can withstand bending over a 2" radius without breaking or damaging the semiconductor device.
REFERENCES:
patent: 5412192 (1995-05-01), Hoss
patent: 5480842 (1996-01-01), Clifton et al.
patent: 5544014 (1996-08-01), Atsumi
Flesher H. Kelly
Youmans Albert P.
Aptek Industries, Inc.
Niebling John
Zarneke David A.
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