4. Metal fusion bonding
  5. Solder form

Gregory B. Martin

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Ceramic ball grid array using in-situ solder stretch

Metal fusion bonding – Process – Plural joints
Patent

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Conductive polymer interconnection configurations

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Reexamination Certificate

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Conductive polymer interconnection configurations

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Electrical interconnection package and method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Enhanced ceramic ball grid array using in-situ solder stretch wi

Stock material or miscellaneous articles – All metal or with adjacent metals – Shaped configuration for melting
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Profile ID: LFUS-PAI-P-380128

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