Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-02-22
2005-02-22
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S307700, C257S737000, C438S614000
Reexamination Certificate
active
06858111
ABSTRACT:
A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.
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IBM Technical Disclosure Bulletin—“Solder Plated Resin Ball” Published May 1995.
Courtney Mark G.
Goldmann Lewis S.
Martin Gregory B.
Perry Charles H.
Aftergut Jeff H.
Cantor & Colburn LLP
Goff John L.
International Business Machines - Corporation
Pepper Margaret A.
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