4. Metal fusion bonding
  5. Process
  6. Chemical reaction produces filler material in situ

Giulio DiGiacomo

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Determination of electric current flow patterns

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – Frequency of cyclic current or voltage
Patent

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Direct chip-cooling through liquid vaporization heat exchange

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Patent

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Low-cost ternary composite for use in vias in glass-ceramic stru

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Patent

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Multi-chip heat-sink cap assembly

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Multi-chip module and heat-sink cap combination

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-231219

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