Low-cost ternary composite for use in vias in glass-ceramic stru

Details Low-cost ternary composite for use in vias in glass-ceramic stru Low-cost ternary composite for use in vias in glass-ceramic stru

1991-08-09

1993-03-09

Walsh, Donald P.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428552, 428560, 428564, 428565, 75230, 75247, B22F 300, B22F 500, B22F 700

Patent

active

051926229

ABSTRACT:
A ternary-alloy/glass composite suitable for use in vias in glass-ceramic electronic structures includes gold, palladium, and either platinum or silver in the alloy where the gold is less than 50% by weight of the alloy. The alloy is combined with glass frit where the glass is present as 5-50% by volume in the composition. The ternary-alloy glass composite is sintered in the glass-ceramic structure and provides a hermetic seal. Chips and pins can be bonded directly to the ternary-alloy/glass composite using a eutectic braze without causing cracks in the glass-ceramic. The ternary-alloy/glass composite has good adhesion with glass-ceramics and is useful in vias in electronic structures.

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patent: 4569876 (1986-02-01), Nakakita
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