Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Inventor
active
Air-bridge integration scheme for reducing interconnect delay
Bi-layer etch stop for inter-level via
Dielectric materials to prevent photoresist poisoning
Electroless deposition method over sub-micron apertures
Electropolishing of metallic interconnects
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Profile ID: LFUS-PAI-P-168451