Electropolishing of metallic interconnects

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S22400M

Reexamination Certificate

active

06951599

ABSTRACT:
Embodiments of the present invention generally relate to a method and apparatus for planarizing a substrate by electropolishing techniques. Certain embodiments of an electropolishing apparatus include a contact ring adapted to support a substrate, a cell body adapted to hold an electropolishing solution, a fluid supply system adapted to provide the electropolishing solution to the cell body, a cathode disposed within the cell body, a power supply system in electrical communication with the contact ring and the cathode, and a controller coupled to at least the fluid supply system and the power supply system. The controller may be adapted to provide a first set of electropolishing conditions to form a boundary layer between the substrate and the electropolishing solution to an initial thickness and may be adapted to provide a second set of electropolishing conditions to control the boundary layer to a subsequent thickness less than or equal to the initial thickness.

REFERENCES:
patent: 3873512 (1975-03-01), Latanision
patent: 4125444 (1978-11-01), Inoue
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5136817 (1992-08-01), Tabata et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6056864 (2000-05-01), Cheung
patent: 6090239 (2000-07-01), Liu et al.
patent: 6103096 (2000-08-01), Datta et al.
patent: 6132586 (2000-10-01), Adams et al.
patent: 6159079 (2000-12-01), Zuniga et al.
patent: 6171467 (2001-01-01), Weihs et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6203684 (2001-03-01), Taylor et al.
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6297159 (2001-10-01), Paton
patent: 6299741 (2001-10-01), Sun et al.
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6440295 (2002-08-01), Wang
patent: 6723224 (2004-04-01), Yahalom et al.
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2001/0040100 (2001-11-01), Wang
patent: 2002/0008036 (2002-01-01), Wang
patent: 2002/0070126 (2002-06-01), Sato et al.
patent: 0 325 753 (1989-08-01), None
patent: 11-42554 (1999-02-01), None
patent: 2001-77117 (2001-03-01), None
patent: 98/49723 (1998-11-01), None
patent: 99/41434 (1999-08-01), None
patent: 00/03426 (2000-01-01), None
patent: 00/26443 (2000-05-01), None
patent: 00/59682 (2000-10-01), None
patent: 01/49452 (2001-07-01), None
patent: 02/23616 (2002-03-01), None
patent: 02/064314 (2002-08-01), None
Nogami, “An innovation in Integrate Porous Low-K Materials and Copper”, Interconnect Japan 2002; Honeywell Seminar Dec. 6, 2001, p 1-12.
U.S. patent application No. 10/141,459, “Electrolyte with Good Planarization Capability, High Removal Rate and Smooth Surface Finish for Electrochemically Controlled Copper CMP”, Sun, et al., no date avail.
U.S. patent application No. 10/038,066, “Planarization of Substrates Using Electrochemical Mechanical Polishing”, Chen, et al., no date avail.
U.S. patent application No. 10/032,275, “Electrolyte Composition and Treatment for Electrolytic Chemical Mechanical Polishing”, Duboust, et al., no date avail.
W.C. Elmore, “Electrolytic Polishing”, Journal of Applied Physics, Received Apr. 14, 1939.
J. Edwards, “The Mechanism of Electropolishing of Copper in Phosphoric Acid Solutions”, Journal of the Electrochemical Society, Jul. 1953.
K. Kojima, et al. “Interpretation of the Impedance Properties of the Anode-Surface Film in the Electropolishing of Copper in Phosphoric Acid” J. Electrochem. Soc.: Electrochemical Science and Technology, Sep. 1973, vol. 120, No. 9.
S. H. Glarum, et al., “The Anodic Dissolution of Copper into Phosphoric Acid”, J. Electrochem. Soc.: Electrochemical Science and Technology Dec. 1985, vol. 132, No. 12.
R.D. Grimm, et al., “AC Impedance Study of Anodically Formed Salt Films on Iron in Chloride Solution” J. Electrochem. Soc., vol. 139, Jun. 1992.
R. Vidal, et al., “Copper Electropolishing in Concentrated Phosphoric Acid”, J. Electrochem. Soc., vol. 142, No. 8, Aug. 1995.
T.P. Hoar, “The Anodic Behaviour of Metals”, Modern Aspects of Electrochemistry No. 2, Butterworths Scientific Publications 1959, no month avail.
P. A. Jacquet, “On the Anodic Behavior of Copper in Aqueous Solutions of Orthophosphoric Acid”, A paper presented at the Sixty-ninth General Meeting, held at Cincinnati Ohio, Apr. 25, 1936.
S. Lopatin, et al. “Characterization of Electrodissolving Copper in Aqueous Acid Solution for Sub-Quarter Micron Interconnect Formation in Low k Materials”, Electrochemical Society Proceedings vol. 99-31, no date available.
R.J. Contolini, et al., “Electrochemical Planarization of ULSI Copper”Jun. 1997 Solid State Technology, no month avail.
P.C. Andriacos, et al., “Damascene Copper Electroplating for Chip Interconnections”, IBM J. Res. Develop. vol. 42, No. 5, Sep. 1998.
T. P. Moffat, et al., “Superconformal Electrodeposition of Copper”, Electrochemical and Solid-State Letters, 4 (4) C26-C29 (2001), no month avail.

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