4. Measuring and testing
  5. Speed, velocity, or acceleration
  6. Structural installation or mounting means

Gerald K. Fehr

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Apparatus for encapsulating IC packages with diamond substrate t

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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IC packages with diamond substrate thermal conductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Metal semiconductor package with an external plastic seal

Fishing – trapping – and vermin destroying
Patent

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Metal semiconductor package with an external plastic seal

Electricity: conductors and insulators – Boxes and housings – With electrical device
Patent

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Method and apparatus for supporting a sensor in a vehicle

Measuring and testing – Speed – velocity – or acceleration – Structural installation or mounting means
Patent

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Profile ID: LFUS-PAI-P-177331

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