Apparatus for encapsulating IC packages with diamond substrate t

Details Apparatus for encapsulating IC packages with diamond substrate t Apparatus for encapsulating IC packages with diamond substrate t

1997-08-25

1999-01-12

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257706, 257712, 257720, H01L 2328, H01L 2310, H01L 2334

Patent

active

058594779

ABSTRACT:
A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.

REFERENCES:
patent: 3872496 (1975-03-01), Potter
patent: 4582954 (1986-04-01), Easton et al.
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5386339 (1995-01-01), Polinski, Sr.
patent: 5444909 (1995-08-01), Mehr
"Diamond Solutions" Papers by Norton Co. Jun. 1993 5 pages.

Affiliated with

Also associated with

Rating

Apparatus for encapsulating IC packages with diamond substrate t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for encapsulating IC packages with diamond substrate t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for encapsulating IC packages with diamond substrate t will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1519451