Fishing – trapping – and vermin destroying
Patent
1995-02-03
1996-02-13
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437209, 437214, 437220, 437221, 437224, H01L 2160
Patent
active
054911109
ABSTRACT:
An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.
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Batinovich Victor
Fehr Gerald K.
Hearn Brian E.
Integrated Packaging Assembly Corporation
Picardat Kevin M.
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