Metal semiconductor package with an external plastic seal

Details Metal semiconductor package with an external plastic seal Metal semiconductor package with an external plastic seal

1994-06-13

1995-07-25

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

With electrical device

257699, 257704, 257710, 257739, 437222, 437224, H01L 2302

Patent

active

054364078

ABSTRACT:
An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.

REFERENCES:
patent: 3241217 (1966-03-01), Nunn
patent: 3254393 (1966-06-01), Grasser
patent: 3714370 (1973-01-01), Nixen et al.
patent: 3988825 (1976-11-01), Fuchs et al.
patent: 4214364 (1980-07-01), St. Louis et al.
patent: 4477827 (1984-10-01), Walker et al.
patent: 4701999 (1987-10-01), Palmer
patent: 4723156 (1988-02-01), Okuaki
patent: 5210375 (1993-05-01), Long
patent: 5270262 (1993-12-01), Switky et al.
Zimmerman, "Projecting Multichip Modules with Molded Packaging", Electronic Packaging and Production; (Oct. 1991).

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