4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

Gerald Friese

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Bond pad structure comprising tungsten or tungsten compound...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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FBEOL process for Cu metallizations free from Al-wirebond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Method and apparatus of stress relief in semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Method and apparatus of stress relief in semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Method of eliminating back-end rerouting in ball grid array...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2389308

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