4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

George J. Ead

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Flowing solder in a gap

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Packaging electrical circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Packaging electrical circuits

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Packaging electrical circuits

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Patent

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Packaging electrical circuits

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Profile ID: LFUS-PAI-P-198959

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