Flowing solder in a gap

Details Flowing solder in a gap Flowing solder in a gap

1997-05-09

1998-03-17

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228170, 2281735, 228175, 428645, B23K 120

Patent

active

057277273

ABSTRACT:
The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap to reduce formation of voids.

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