Gary L. Beene

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Chip carrier with interconnects on lid

Patent

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High-density package

Patent

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Method of forming an electronic device having I/O reroute

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Rerouted semiconductor device and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1356609

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