1985-11-22
1990-07-24
Hille, Rolf
357 75, 357 81, H01L 2304, H01L 2336, H01L 2312
Patent
active
049438441
ABSTRACT:
A chip carrier with improved packing density, wherein at least one layer of chips is bonded not directly to the substrate, but rather to a heat plate which attaches over the chip cavity and inside the hermetic sealing lid. The heat plate has openings in it to permit attachment of the leads from the chips in the upper layer to bond pads on a bonding ledge inside the cavity of the chip carrier, after the heat plate is emplaced. Each bonding ledge is preferably made somwhat wider than it would otherwise be, and the leads from multiple layers of chips are preferably bonded onto the same bonding ledge.
REFERENCES:
patent: 4541003 (1985-09-01), Otsuka et al.
"Directly Attached IC Circuit Lead Frame"-DeBoskey IBM Technical Disclsure Bullentin-vol. 15, No. 10, June 1972, p. 307.
"Cooling and Minimizing Temperature Gradient in Stacked Modules"-Audi-IBM Technical Disclosure Bulletin-vol. 19, No. 2-Jul. 1976, p. 414.
Beene Gary L.
Oscilowski Alex A.
Williams Charles E.
Zogas Peter
Clark S. V.
Grossman Rene E.
Hille Rolf
Sharp Melvin
Texas Instruments Incorporated
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