Chip carrier with interconnects on lid

Details Chip carrier with interconnects on lid Chip carrier with interconnects on lid

1985-11-22

1990-02-20

Hille, Rolf

357 75, H01L 2314, H01L 2302, H01L 2712

Patent

active

049031201

ABSTRACT:
A chip carrier with multiple through hole vias in its hermetic sealing lid. One or more chips is mounted on the inner surface of that lid. The lid contains multiple through vias, and the semiconductor chip on the inner surface of the lid is bonded to the vias in the lid by TAB strips or (optionally) by wire bonds. The vias in the lid connect these leads through to contacts on the outer surface of the package. These contacts can than be connected to (using interconnect structures such as TAB strips, or printed wiring boards, or discretionary wiring), to provide circuit interconnection. Preferably low-power-dissipation chips are mounted on the inner surface of the lid in this fashion, with higher-power-dissipation chips mounted on the bottom surface of the chip cavity.

REFERENCES:
patent: 4285002 (1981-08-01), Campbell
patent: 4445274 (1984-05-01), Suzuki et al.
"Metallized Ceramic Substrate in the Low Inductance"-IBM Technical Disclosure Bulletin-vol. 78, No. 2, Jul. 1985, p. 768.

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