4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Thinning of semiconductor substrate

Ganesh Vetrivel Periasamy

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Method for ultra thinning bumped wafers for flip chip

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Polymer encapsulated dicing lane (PEDL) technology for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

RF and MMIC stackable micro-modules

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ganesh Vetrivel Periasamy does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Ganesh Vetrivel Periasamy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ganesh Vetrivel Periasamy will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2969245

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure