Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2006-11-28
2006-11-28
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C257SE21001
Reexamination Certificate
active
07141487
ABSTRACT:
In an improved method for bumped wafer thinning, a wafer is provided having a front side and a back side wherein contact pads are formed on the top surface. A dry film is formed on the front side of the wafer and openings are provided in the dry film to the contact pads. Interconnections, such as solder bumps, are formed within the openings on the contact pads. A back grind tape or carrier is attached to the dry film and overlying the interconnections. Thereafter, the wafer is thinned from the back side of the wafer.
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Kripesh Vaidyanathan
Periasamy Ganesh Vetrivel
Ackerman Stephen B.
Agency for Science Technology and Research
Geyer Scott B.
Pike Rosemary L. S.
Saile Ackerman LLC
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