4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Frank S. Geefay

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Attachment system incorporating a recess in a structure

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove
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Die singulation using deep silicon etching

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Film deposition to enhance sealing yield of microcap...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Method for placing metal contacts underneath FBAR resonators

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
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Method for sealing a semiconductor device and apparatus...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Profile ID: LFUS-PAI-P-2064789

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