Attachment system incorporating a recess in a structure

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove

Reexamination Certificate

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C257S723000, C361S784000, C438S107000

Reexamination Certificate

active

07554177

ABSTRACT:
An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.

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patent: 2004/0262781 (2004-12-01), Germain et al.
patent: 2006/0278882 (2006-12-01), Leung et al.
patent: 2007/0045780 (2007-03-01), Akram et al.

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