4. Metal fusion bonding
  5. Including means to apply flux or filler to work or applicator

Frank Burke DiPiazza

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Interposer for mounting semiconductor dice on substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Molten solder dispensing system

Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent

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Molten solder dispensing system

Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent

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Profile ID: LFUS-PAI-P-110811

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