Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent
1998-01-28
1999-12-14
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
228256, 222591, 2395905, B23K 306
Patent
active
060005971
ABSTRACT:
An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
REFERENCES:
patent: 1760519 (1930-05-01), Palmer
patent: 1906225 (1933-05-01), Dupau
patent: 2780712 (1957-02-01), Thomas
patent: 3222776 (1965-12-01), Kawecki
patent: 3332474 (1967-07-01), Sickbert
patent: 3358897 (1967-12-01), Christensen
patent: 3408059 (1968-10-01), Hornak
patent: 3423029 (1969-01-01), Demaison
patent: 4364067 (1982-12-01), Koto et al.
patent: 4546815 (1985-10-01), Liebermann et al.
patent: 4603727 (1986-08-01), Hsu
patent: 4743465 (1988-05-01), Saeki et al.
patent: 4898117 (1990-02-01), Ledermann et al.
patent: 4934309 (1990-06-01), Ledermann et al.
patent: 5042708 (1991-08-01), Ledermann et al.
patent: 5065932 (1991-11-01), Hayden et al.
patent: 5104689 (1992-04-01), Hayden et al.
patent: 5176312 (1993-01-01), Lowenthal
patent: 5238176 (1993-08-01), Nishimura
patent: 5244143 (1993-09-01), Ference et al.
patent: 5261611 (1993-11-01), Huxford
patent: 5266113 (1993-11-01), Konno
patent: 5364011 (1994-11-01), Baker et al.
patent: 5377961 (1995-01-01), Smith et al.
patent: 5381946 (1995-01-01), Koopman et al.
patent: 5571440 (1996-11-01), Eckert
patent: 5897062 (1999-04-01), Enomoto et al.
DiPiazza Frank Burke
Goenka Lakhi Nandial
Jairazbhoy Vivek Amir
Stevenson Randy Claude
Straub Marc Alan
Ford Motor Company
Heinrich Samuel M.
Malleck Joseph W.
May Roger L.
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