Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent
1996-05-15
1998-05-05
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
228256, 222594, B23K 306
Patent
active
057463689
ABSTRACT:
An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
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DiPiazza Frank Burke
Goenka Lakhi Nandial
Jairazbhoy Vivek Amir
Stevenson Randy Claude
Straub Marc Alan
Ford Motor Company
Heinrich Samuel M.
Malleck Joseph W.
May Roger L.
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