4. Semiconductor device manufacturing: process
  5. Formation of electrically isolated lateral semiconductive...
  6. Grooved and refilled with deposited dielectric material

Feng Dai

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Aluminum-filled via structure with barrier layer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method to achieve STI planarization

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate

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Trench-based capacitor for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2823570

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