4. Metal treatment
  5. Compositions
  6. Fluxing

Fadia Nounou

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Backplane grounding for flip-chip integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Gas manifold for solder reflow processing atmosphere

Chemical apparatus and process disinfecting – deodorizing – preser – Chemical reactor – Including solid – extended surface – fluid contact reaction...
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Method of cleaning printed circuit boards using formic acid

Metal treatment – Compositions – Fluxing
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Method of cleaning printed circuit boards using water

Metal treatment – Compositions – Fluxing
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Method of manufacturing a circuit carrying substrate having coax

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-466365

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