Method of manufacturing a circuit carrying substrate having coax

Details Method of manufacturing a circuit carrying substrate having coax Method of manufacturing a circuit carrying substrate having coax

1994-04-01

1995-06-06

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29828, 174 36, 174250, H05K 310

Patent

active

054210836

ABSTRACT:
A method of manufacturing a circuit carrying substrate having one or more coaxial via holes. The center core or inner layer (330) of the circuit carrying substrate is a dielectric material that has a plated (339) through hole or via (335) coupling the two surfaces of the inner layer together. One side of the inner layer has a first metallization pattern (336) and the other side has a second metallization pattern (338) on it. The through hole is electrically conductive (339) and connects portions of the first and second metallization patterns. The plated through hole is filled with a dielectric material (340). A first dielectric layer (342) is formed on one side of the inner layer, and a second dielectric layer (344) is formed on the other side of the inner layer, so that the dielectric layers cover the first and second metallization patterns and the filled via hole. A third metallization pattern (350) is formed on the first dielectric layer, and a fourth metallization pattern (360) is formed on the second dielectric layer. A second via hole (370) is formed within the first via hole, substantially concentric to and electrically insulated from the first via hole, to electrically connect the third and fourth metallization patterns.

REFERENCES:
patent: 4642889 (1987-02-01), Grabbe
patent: 4675788 (1987-02-01), Breitling et al.
patent: 4776087 (1988-10-01), Cronin et al.
patent: 5233133 (1993-08-01), Iwasaki et al.
patent: 5323534 (1994-06-01), Iwasaki et al.
patent: 5363550 (1994-11-01), Aitken et al.

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