4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Ernest N. Urfer

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Method of fabricating an improved multi-layer ceramic substrate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Multi-layer ceramic substrate

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits
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Process and structure for minimizing delamination in the fabrica

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Recessed metallurgy for dielectric substrates

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Profile ID: LFUS-PAI-P-873058

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