Process and structure for minimizing delamination in the fabrica

Details Process and structure for minimizing delamination in the fabrica Process and structure for minimizing delamination in the fabrica

1981-05-28

1983-09-27

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 80, 174 685, H01L 2348, H01L 2944, H01L 2952

Patent

active

044070071

ABSTRACT:
A process and a solid plane structure for minimizing delamination during sintering in the fabrication of multi-layer ceramic substrates, wherein the solid plane structure is designed to obtain maximum ceramic to ceramic interface contact.

REFERENCES:
patent: 4237606 (1980-12-01), Niwa et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4302625 (1981-11-01), Hetherington et al.

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