Method of fabricating an improved multi-layer ceramic substrate

Details Method of fabricating an improved multi-layer ceramic substrate Method of fabricating an improved multi-layer ceramic substrate

1981-04-27

1982-06-22

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29851, 174 685, 361406, 361411, H05K 114

Patent

active

043360882

ABSTRACT:
A method of fabricating an improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.

REFERENCES:
patent: 3189978 (1965-06-01), Stetson
patent: 3726002 (1973-04-01), Greenstein
patent: 3999004 (1976-12-01), Chirino
patent: 4047290 (1977-09-01), Weitze
patent: 4109377 (1978-08-01), Blazick
patent: 4137628 (1979-02-01), Suzuki
patent: 4189524 (1980-02-01), Lazzari
patent: 4202007 (1980-05-01), Dougherty
patent: 4245273 (1981-01-01), Feinberg

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