Recessed metallurgy for dielectric substrates

Details Recessed metallurgy for dielectric substrates Recessed metallurgy for dielectric substrates

1974-02-11

1976-05-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156268, 156272, 219121LM, 427 43, 427 53, 427123, 427272, 427276, 427287, B32B 3100

Patent

active

039560520

ABSTRACT:
A ceramic green sheet material is metallized by laminating a thin organic material, preferably MYLAR, to a ceramic green sheet surface, and then employing an electron beam to define a predetermined pattern of openings extending through the organic material and selectively into and through the green sheet. The resulting channels and via holes are then filled with a metal paste. The organic mask is removed by peeling subsequent to the metal paste deposition step.

REFERENCES:
patent: 2016600 (1935-10-01), Gray
patent: 3189978 (1965-06-01), Stetson
patent: 3322653 (1967-05-01), Morris
patent: 3333334 (1967-08-01), Kuliczkowski et al.
patent: 3463653 (1969-08-01), Letter
patent: 3505139 (1970-04-01), Wentworth
patent: 3668028 (1972-06-01), Short
patent: 3705060 (1972-12-01), Stork
patent: 3770529 (1973-11-01), Anderson
patent: 3867217 (1975-02-01), Muggs et al.
"Laser `Via` Punching of Ceramic Green Sheet," J. A. Griesmer et al., IBM Technical Disclosure Bulletin, Vol. 15, No. 7, pp. 2303, 12-72.

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