Ernest J. Funk

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Apparatus for bonding leads to semiconductor chips

Facsimile and static presentation processing – Facsimile – Specific signal processing circuitry
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Locking mechanism for use in a chuck for an optical alignment an

Photocopying – Projection printing and copying cameras – Detailed holder for photosensitive paper
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Two part package for a semiconductor die

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Profile ID: LFUS-PAI-P-755483

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