Patent
1970-12-21
1976-03-30
Edlow, Martin H.
H01L 2348
Patent
active
039478670
ABSTRACT:
Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.
REFERENCES:
patent: 3519890 (1970-07-01), Ashby
patent: 3559285 (1971-02-01), Kauffman
Duffek Edward F.
Funk Ernest J.
Jankowski Alfred S.
Lane Jack C.
Lehner William L.
Edlow Martin H.
Signetics Corporation
Wojciechowicz E.
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