Apparatus for bonding leads to semiconductor chips

Details Apparatus for bonding leads to semiconductor chips Apparatus for bonding leads to semiconductor chips

1978-09-25

1981-02-24

Griffin, Robert L.

Facsimile and static presentation processing

Facsimile

Specific signal processing circuitry

364491, H04N 718

Patent

active

042531110

ABSTRACT:
In the bonding apparatus disclosed herein, possible misalignment of a semiconductor chip at the work station is sensed by first optically scanning the workpiece using a video scanning head mounted on a common X-Y carriage with the bonding head. A zone signal is generated which defines, within the scanned area, a limited zone of consideration. The video signal is evaluated as a function of the zone signal to measure the extent of coincidence between the zone and a target area on the workpiece. The placement and dimensions of the zone are progressively adjusted responsive to the evaluation and in accordance with a search algorithm to locate at least two target areas on the workpiece and the bonding head is then traversed to adjusted target coordinates derived from the optically located target areas.

REFERENCES:
patent: 3643018 (1972-02-01), Adler
patent: 3814845 (1974-06-01), Hurlbrink
patent: 3903363 (1975-09-01), Montone
patent: 3988535 (1976-10-01), Hickman
"Automatic CCTV Positioning System," IBM Tech. Disc. Bulletin, vol. 14, #8, (Jan. 1972), Duffy et al, pp. 2348-2350.

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