Erick G. Walton

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Aluminum bump, reworkable bump, and titanium nitride structure f

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Array fuse damage protection devices and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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Array protection devices and fabrication method

Fishing – trapping – and vermin destroying
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Barrierless high-temperature lift-off process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
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Chromium-titanium alloy

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Profile ID: LFUS-PAI-P-552787

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