4. Metal fusion bonding
  5. Process
  6. With protecting of work or filler or applying flux

Elke Zakel

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Bump with basic metallization and method for manufacturing...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Chip housing

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Chip module with conductor paths on the chip bonding side of a c

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Chip support arrangement and chip support for the manufacture of

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Chip-contacting method requiring no contact bumps, and electroni

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Profile ID: LFUS-PAI-P-43306

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