Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Chip-to-chip optical interconnect
Chip-to-chip optical interconnect
Method of marking glass
Microelectronic package with carbon nanotubes interconnect...
Through silicon via, folded flex microelectronic package
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Profile ID: LFUS-PAI-P-2377505