Through silicon via, folded flex microelectronic package

Details Through silicon via, folded flex microelectronic package Through silicon via, folded flex microelectronic package

2005-08-02

2005-08-02

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With large area flexible electrodes in press contact with...

C257S691000, C257S693000, C257S723000, C257S737000

Reexamination Certificate

active

06924551

ABSTRACT:
A microelectronic package including a microelectronic die having through silicon vias extending through a back surface thereof, which allows both an active surface and the back surface of the microelectronic die to have power, ground, and/or input/output signals connected to a flexible substrate. The flexible substrate may further connected to an external substrate through at least one external contact.

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patent: 6633078 (2003-10-01), Hamaguchi et al.
patent: 2004/0021139 (2004-02-01), Jackson et al.

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