Chip-to-chip optical interconnect

Details Chip-to-chip optical interconnect Chip-to-chip optical interconnect

2008-05-13

2008-05-13

Sanghavi, Hemang (Department: 2874)

Optical waveguides

Integrated optical circuit

C385S049000, C385S092000, C257S432000, C257S779000

Reexamination Certificate

active

11452820

ABSTRACT:
A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.

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